专利名称：Metallization of dielectrics
发明人：Frank Scaraglino,Walter Sommer,Neil D.
Brown,Kai Wang
申请号：US11634062申请日：20061205
公开号：US20070128366A1公开日：20070607
摘要：A composition and method are disclosed. The composition both conditions andactivates a dielectric material for metal deposition. The metal may be deposited on thedielectric by electroless methods. The metallized dielectric may be used in electronicdevices.
申请人：Frank Scaraglino,Walter Sommer,Neil D. Brown,Kai Wang
地址：North Babylon NY US,Maspeth NY US,Merrick NY US,Hicksville NY US
国籍：US,US,US,US
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