Semiconductor device including semiconductor const

专利名称：Semiconductor device including

semiconductor constituent

发明人：Hiroyasu Jobetto申请号：US12729608申请日：20100323公开号：US08063490B2公开日：20111122

专利附图：

摘要：A semiconductor device includes a semiconductor constituent having asemiconductor substrate and a plurality of electrodes for external connection providedunder the semiconductor substrate. An under-layer insulating film is provided under and

around the semiconductor constituent. A plurality of under-layer wires are providedunder the under-layer insulating film and electrically connected to the electrodes forexternal connection of the semiconductor constituent. An insulating layer is providedaround the semiconductor constituent and on the under-layer insulating film. A frame-like insulating substrate is embedded in an upper surface of the insulating layer andpositioned around the semiconductor constituent. A plurality of upper-layer wires areprovided on the insulating substrate. A base plate on which the semiconductorconstituent and the insulating layer are mounted is removed.

申请人：Hiroyasu Jobetto

地址：Hachioji JP

国籍：JP

代理机构：Holtz, Holtz, Goodman & Chick, PC

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