专利名称：Electronic assembly and cooling thereof发明人：Krishna Seshan申请号：US10012994申请日：20011210公开号：US06480385B2公开日：20021112
专利附图：
摘要：An integrated circuit that includes a die having a circuit area and outer edges. Aguard ring surrounds the circuit area within the outer edges of the die. The guard ringincludes a projection that extends to at least one outer edge of the die to extract heatfrom the die that is generated during operation of the integrated circuit.
申请人：INTEL CORPORATION
代理机构：Schwegman, Lundberg, Woessner & Kluth, P.A.
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