AT24C128-256存储器

•Low-voltageandStandard-voltageOperation–2.7(VCC=2.7Vto5.5V)–1.8(V•CC=1.8Vto3.6V)

InternallyOrganized16,384x8and32,768x8•2-wireSerialInterface

•SchmittTrigger,FilteredInputsforNoiseSuppression•BidirectionalDataTransferProtocol

•1MHz(5V),400kHz(2.7V,2.5V)and100kHz(1.8V)Compatibility•WriteProtectPinforHardwareandSoftwareDataProtection•64-bytePageWriteMode(PartialPageWritesAllowed)•Self-timedWriteCycle(5msTypical)•HighReliability

–Endurance:100,000WriteCycles–DataRetention:40Years

•AutomotiveGradeandExtendedTemperatureDevicesAvailable

•

8-pinJEDECPDIP,8-pinJEDECandEIAJSOIC,8-pinTSSOP,14-pinTSSOPand8-balldBGATMPackages

Description

TheAT24C128/256provides131,072/262,144bitsofserialelectricallyerasableandprogrammablereadonlymemory(EEPROM)organizedas16,384/32,768wordsof8bitseach.Thedevice’scascadablefeatureallowsupto4devicestoshareacommon2-wirebus.Thedeviceisoptimizedforuseinmanyindustrialandcommercialapplica-tionswherelowpowerandlowvoltageoperationareessential.Thedevicesareavailableinspace-saving8-pinJEDECPDIP,8-pinJEDECSOIC,8-pinEIAJSOIC,8-pinTSSOP,14-pinTSSOPand8-balldBGApackages.Inaddition,theentirefamilyisavailablein2.7V(2.7Vto5.5V)and1.8V(1.8Vto3.6V)versions.

PinConfigurations

8-pinPDIP

8-pinSOIC

PinNameFunctionA018VCCA018VCCA0-A1AddressInputsA127WPA127WPNC36SCLNC36SCLSDASerialDataGND45SDAGND45SDASCLSerialClockInputWPWriteProtect8-balldBGA

8-pinTSSOP

NCNoConnectVCC81A0A018VCCWP72A1A127WPSCL63NCA236SCLSDA54GNDGND45SDABottomView

14-pinTSSOP

A0114VCCA1213WPNC312NCNC411NCNC510NCNC69SCLGND78SDA2-wireSerialEEPROMs128K(16,384x8)256K(32,768x8)AT24C128AT24C256Rev.0670F–SEEPR–2/021

AbsoluteMaximumRatings*

OperatingTemperature..................................-55°Cto+125°CStorageTemperature.....................................-65°Cto+150°CVoltageonAnyPinwithRespecttoGround.....................................-1.0Vto+7.0VMaximumOperatingVoltage..........................................6.25VDCOutputCurrent........................................................5.0mA*NOTICE:

Stressesbeyondthoselistedunder“AbsoluteMaximumRatings”maycausepermanentdam-agetothedevice.Thisisastressratingonlyandfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedintheoperationalsectionsofthisspecificationisnotimplied.Exposuretoabsolutemaximumratingconditionsforextendedperiodsmayaffectdevicereliability.

BlockDiagram

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AT24C128/256

PinDescription

SERIALCLOCK(SCL):TheSCLinputisusedtopositiveedgeclockdataintoeachEEPROMdeviceandnegativeedgeclockdataoutofeachdevice.

SERIALDATA(SDA):TheSDApinisbidirectionalforserialdatatransfer.Thispinisopen-draindrivenandmaybewire-ORedwithanynumberofotheropen-drainoropencollectordevices.

DEVICE/PAGEADDRESSES(A1,A0):TheA1andA0pinsaredeviceaddressinputsthatarehardwiredorleftnotconnectedforhardwarecompatibilitywithAT24C32/64.Whenthepinsarehardwired,asmanyasfour128K/256Kdevicesmaybeaddressedonasinglebussystem(deviceaddressingisdiscussedindetailundertheDeviceAddressingsection).Whenthepinsarenothardwired,thedefaultA1andA0arezero.

WRITEPROTECT(WP):Thewriteprotectinput,whentiedtoGND,allowsnormalwriteoper-ations.WhenWPistiedhightoVCC,allwriteoperationstothememoryareinhibited.Ifleftunconnected,WPisinternallypulleddowntoGND.SwitchingWPtoVCCpriortoawriteoper-ationcreatesasoftwarewriteprotectfunction.

Memory

Organization

AT24C128/256,128K/256KSERIALEEPROM:The128K/256Kisinternallyorganizedas256/512pagesof64-byteseach.Randomwordaddressingrequiresa14/15-bitdatawordaddress.

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PinCapacitance(1)

ApplicableoverrecommendedoperatingrangefromTA=25°C,f=1.0MHz,VCC=+1.8V.SymbolCI/OCINNote:

TestConditionInput/OutputCapacitance(SDA)InputCapacitance(A0,A1,SCL)1.Thisparameterischaracterizedandisnot100%tested.

Max86UnitspFpFConditionsVI/O=0VVIN=0VDCCharacteristics(1)

Applicableoverrecommendedoperatingrangefrom:TAI=-40°Cto+85°C,VCC=+1.8Vto+5.5V,TAC=0°Cto+70°C,VCC=+1.8Vto+5.5V(unlessotherwisenoted).SymbolVCC1VCC2VCC3ICC1ICC2ISB1ParameterSupplyVoltageSupplyVoltageSupplyVoltageSupplyCurrentSupplyCurrentStandbyCurrent(1.8Voption)StandbyCurrent(2.5Voption)StandbyCurrent(5.0Voption)InputLeakageCurrentOutputLeakageCurrentInputLowLevel(1)InputHighLevel(1)OutputLowLevelOutputLowLevelVCC=3.0VVCC=1.8VIOL=2.1mAIOL=0.15mAVCC=5.0VVCC=5.0VVCC=1.8VVCC=3.6VVCC=2.5VVCC=5.5VVCC=4.5-5.5VVIN=VCCorVSSVOUT=VCCorVSS-0.6VCCx0.7READat400kHzWRITEat400kHzVIN=VCCorVSSTestConditionMin1.82.54.51.02.0TypMax3.65.55.52.03.01.03.02.06.06.00.100.053.03.0VCCx0.3VCC+0.50.40.2µAµAµAVVVVµAUnitsVVVmAmAµAISB2ISB3ILIILOVILVIHVOL2VOL1Note:

VIN=VCCorVSSVIN=VCCorVSS1.VILminandVIHmaxarereferenceonlyandarenottested.

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AT24C128/256

ACCharacteristics

ApplicableoverrecommendedoperatingrangefromTA=-40°Cto+85°C,VCC=+1.8Vto+5.5V,CL=100pF(unlessoth-erwisenoted).TestconditionsarelistedinNote2.1.8-voltSymbolfSCLtLOWtHIGHtAAtBUFtHD.STAtSU.STAtHD.DATtSU.DATtRtFtSU.STOtDHtWREndurance(1)Notes:

ParameterClockFrequency,SCLClockPulseWidthLowClockPulseWidthHighClockLowtoDataOutValidTimethebusmustbefreebeforeanewtransmissioncanstart(1)StartHoldTimeStartSet-upTimeDataInHoldTimeDataInSet-upTimeInputsRiseTime(1)InputsFallTime(1)StopSet-upTimeDataOutHoldTimeWriteCycleTime5.0V,25°C,PageMode100K4.710020100K4.74.00.14.74.04.702001.03000.65010100K4.5MinMax1001.30.60.051.30.60.601000.33000.2550100.92.5-voltMinMax4000.40.40.050.50.250.2501000.31000.555.0-voltMinMax1000UnitskHzµsµsµsµsµsµsµsnsµsnsµsnsmsWriteCycles1.Thisparameterischaracterizedandisnot100%tested.2.ACmeasurementconditions:

RL(connectstoVCC):1.3kΩ(2.5V,5V),10kΩ(1.8V)Inputpulsevoltages:0.3VCCto0.7VCCInputriseandfalltimes:≤50ns

Inputandoutputtimingreferencevoltages:0.5VCC

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DeviceOperation

CLOCKandDATATRANSITIONS:TheSDApinisnormallypulledhighwithanexternaldevice.DataontheSDApinmaychangeonlyduringSCLlowtimeperiods(refertoDataValiditytimingdiagram).DatachangesduringSCLhighperiodswillindicateastartorstopconditionasdefinedbelow.

STARTCONDITION:Ahigh-to-lowtransitionofSDAwithSCLhighisastartconditionwhichmustprecedeanyothercommand(refertoStartandStopDefinitiontimingdiagram).STOPCONDITION:Alow-to-hightransitionofSDAwithSCLhighisastopcondition.Afterareadsequence,thestopcommandwillplacetheEEPROMinastandbypowermode(refertoStartandStopDefinitiontimingdiagram).

ACKNOWLEDGE:AlladdressesanddatawordsareseriallytransmittedtoandfromtheEEPROMin8-bitwords.TheEEPROMsendsazeroduringtheninthclockcycletoacknowl-edgethatithasreceivedeachword.

STANDBYMODE:TheAT24C128/256featuresalowpowerstandbymodewhichisenabled:a)uponpower-upandb)afterthereceiptoftheSTOPbitandthecompletionofanyinternaloperations.

MEMORYRESET:Afteraninterruptioninprotocol,powerlossorsystemreset,any2-wirepartcanberesetbyfollowingthesesteps:(a)Clockupto9cycles,(b)lookforSDAhighineachcyclewhileSCLishighandthen(c)createastartconditionasSDAishigh.

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BusTiming(SCL:SerialClock,SDA:SerialDataI/O)

WriteCycleTiming(SCL:SerialClock,SDA:SerialDataI/O)

SCLSDAACKtWRSTOPCONDITIONNote:

(1)8th BITWORD nSTARTCONDITION1.ThewritecycletimetWRisthetimefromavalidstopconditionofawritesequencetotheendoftheinternalclear/writecycle.

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DataValidity

StartandStopDefinition

OutputAcknowledge

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AT24C128/256

Device

Addressing

The128K/256KEEPROMrequiresan8-bitdeviceaddresswordfollowingastartconditiontoenablethechipforareadorwriteoperation(refertoFigure1).Thedeviceaddresswordcon-sistsofamandatoryone,zerosequenceforthefirstfivemostsignificantbitsasshown.Thisiscommontoall2-wireEEPROMdevices.

The128K/256KusesthetwodeviceaddressbitsA1,A0toallowasmanyasfourdevicesonthesamebus.Thesebitsmustcomparetotheircorrespondinghardwiredinputpins.TheA1andA0pinsuseaninternalproprietarycircuitthatbiasesthemtoalogiclowconditionifthepinsareallowedtofloat.

Theeighthbitofthedeviceaddressistheread/writeoperationselectbit.Areadoperationisinitiatedifthisbitishighandawriteoperationisinitiatedifthisbitislow.

Uponacompareofthedeviceaddress,theEEPROMwilloutputazero.Ifacompareisnotmade,thedevicewillreturntoastandbystate.

DATASECURITY:TheAT24C128/256hasahardwaredataprotectionschemethatallowstheusertowriteprotectthewholememorywhentheWPpinisatVCC.

Write

Operations

BYTEWRITE:Awriteoperationrequirestwo8-bitdatawordaddressesfollowingthedeviceaddresswordandacknowledgment.Uponreceiptofthisaddress,theEEPROMwillagainrespondwithazeroandthenclockinthefirst8-bitdataword.Followingreceiptofthe8-bitdataword,theEEPROMwilloutputazero.Theaddressingdevice,suchasamicrocontroller,thenmustterminatethewritesequencewithastopcondition.AtthistimetheEEPROMentersaninternally-timedwritecycle,tWR,tothenonvolatilememory.AllinputsaredisabledduringthiswritecycleandtheEEPROMwillnotresponduntilthewriteiscomplete(refertoFigure2).

PAGEWRITE:The128K/256KEEPROMiscapableof64-bytepagewrites.

Apagewriteisinitiatedthesamewayasabytewrite,butthemicrocontrollerdoesnotsendastopconditionafterthefirstdatawordisclockedin.Instead,aftertheEEPROMacknowledgesreceiptofthefirstdataword,themicrocontrollercantransmitupto63moredatawords.TheEEPROMwillrespondwithazeroaftereachdatawordreceived.Themicrocontrollermustterminatethepagewritesequencewithastopcondition(refertoFigure3).

Thedatawordaddresslower6bitsareinternallyincrementedfollowingthereceiptofeachdataword.Thehigherdatawordaddressbitsarenotincremented,retainingthememorypagerowlocation.Whenthewordaddress,internallygenerated,reachesthepageboundary,thefollowingbyteisplacedatthebeginningofthesamepage.Ifmorethan64datawordsaretransmittedtotheEEPROM,thedatawordaddresswill“rollover”andpreviousdatawillbeoverwritten.Theaddress“rollover”duringwriteisfromthelastbyteofthecurrentpagetothefirstbyteofthesamepage.

ACKNOWLEDGEPOLLING:Oncetheinternally-timedwritecyclehasstartedandtheEEPROMinputsaredisabled,acknowledgepollingcanbeinitiated.Thisinvolvessendingastartconditionfollowedbythedeviceaddressword.Theread/writebitisrepresentativeoftheoperationdesired.OnlyiftheinternalwritecyclehascompletedwilltheEEPROMrespondwithazero,allowingthereadorwritesequencetocontinue.

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Read

Operations

Readoperationsareinitiatedthesamewayaswriteoperationswiththeexceptionthattheread/writeselectbitinthedeviceaddresswordissettoone.Therearethreereadoperations:currentaddressread,randomaddressreadandsequentialread.

CURRENTADDRESSREAD:Theinternaldatawordaddresscountermaintainsthelastaddressaccessedduringthelastreadorwriteoperation,incrementedbyone.Thisaddressstaysvalidbetweenoperationsaslongasthechippowerismaintained.Theaddress“rollover”duringreadisfromthelastbyteofthelastmemorypage,tothefirstbyteofthefirstpage.

Oncethedeviceaddresswiththeread/writeselectbitsettooneisclockedinandacknowl-edgedbytheEEPROM,thecurrentaddressdatawordisseriallyclockedout.Themicrocontrollerdoesnotrespondwithaninputzerobutdoesgenerateafollowingstopcondi-tion(refertoFigure4).

RANDOMREAD:Arandomreadrequiresa“dummy”bytewritesequencetoloadinthedatawordaddress.OncethedeviceaddresswordanddatawordaddressareclockedinandacknowledgedbytheEEPROM,themicrocontrollermustgenerateanotherstartcondition.Themicrocontrollernowinitiatesacurrentaddressreadbysendingadeviceaddresswiththeread/writeselectbithigh.TheEEPROMacknowledgesthedeviceaddressandseriallyclocksoutthedataword.Themicrocontrollerdoesnotrespondwithazerobutdoesgenerateafol-lowingstopcondition(refertoFigure5).

SEQUENTIALREAD:Sequentialreadsareinitiatedbyeitheracurrentaddressreadoraran-domaddressread.Afterthemicrocontrollerreceivesadataword,itrespondswithanacknowledge.AslongastheEEPROMreceivesanacknowledge,itwillcontinuetoincrementthedatawordaddressandseriallyclockoutsequentialdatawords.Whenthememoryaddresslimitisreached,thedatawordaddresswill“rollover”andthesequentialreadwillcon-tinue.Thesequentialreadoperationisterminatedwhenthemicrocontrollerdoesnotrespondwithazerobutdoesgenerateafollowingstopcondition(refertoFigure6).Figure1.DeviceAddress

Figure2.ByteWrite

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Figure3.PageWrite

Notes:

(*=DON’TCAREbit)

(†=DON’TCAREbitforthe128K)

Figure4.CurrentAddressRead

Figure5.RandomRead

Notes:

(*=DON’TCAREbit)

(†=DON’TCAREbitforthe128K)

Figure6.SequentialRead

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AT24C128OrderingInformation

tWR(max)(ms)10ICC(max)(µA)1500ISB(max)(µA)0.5fMAX(kHz)400OrderingCodeAT24C128-10PI-2.7AT24C128N-10SI-2.7AT24C128W-10SI-2.7AT24C128-10UI-2.7AT24C128T1-10TI-2.7AT24C128-10PI-1.8AT24C128N-10SI-1.8AT24C128W-10SI-1.8AT24C128-10UI-1.8AT24C128T1-10TI-1.8Package8P38S18S28U114A28P38S18S28U114A2OperationRangeIndustrial(-40°Cto85°C)208000.2100Industrial(-40°Cto85°C)PackageType8P38S18S28U114A28-lead,0.300\"Wide,PlasticDualInlinePackage(PDIP)8-lead,0.150\"Wide,PlasticGullWingSmallOutlinePackage(JEDECSOIC)8-lead,0.200\"Wide,PlasticGullWingSmallOutlinePackage(EIAJSOIC)8-ball,dieBallGridArrayPackage(dBGA)14-lead,0.170\"Wide,ThinShrinkSmallOutlinePackage(TSSOP)Options-2.7-1.8Low-voltage(2.7Vto5.5V)Low-voltage(1.8Vto3.6V)12

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AT24C128/256

AT24C256OrderingInformation

tWR(max)(ms)10ICC(max)(µA)1500ISB(max)(µA)0.5fMAX(kHz)400OrderingCodeAT24C256-10PI-2.7AT24C256N-10SI-2.7AT24C256W-10SI-2.7AT24C256-10UI-2.7AT24C256-10TI-2.7AT24C256-10PI-1.8AT24C256N-10SI-1.8AT24C256W-10SI-1.8AT24C256-10UI-1.8AT24C256-10TI-1.8Package8P38S18S28U68A28P38S18S28U68A2OperationRangeIndustrial(-40°Cto85°C)208000.2100Industrial(-40°Cto85°C)PackageType8P38S18S28U68A28-lead,0.300\"Wide,PlasticDualInlinePackage(PDIP)8-lead,0.150\"Wide,PlasticGullWingSmallOutlinePackage(JEDECSOIC)8-lead,0.200\"Wide,PlasticGullWingSmallOutlinePackage(EIAJSOIC)8-ball,dieBallGridArrayPackage(dBGA)8-lead,0.170\"Wide,ThinShrinkSmallOutlinePackage(TSSOP)Options-2.7-1.8Low-voltage(2.7Vto5.5V)Low-voltage(1.8Vto3.6V)13

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PackagingInformation

8P3–PDIP

EE11NTop ViewceAEnd ViewCOMMON DIMENSIONS(Unit of Measure = inches)DD1eA2ASYMBOLMINNOMMAXNOTEAA2bb2b3cD0.1150.0140.0450.0300.0080.3550.0050.3000.2400.3100.2500.100 BSC0.300 BSC0.1150.1300.1300.0180.0600.0390.0100.3650.2100.1950.0220.0700.0450.0140.4000.3250.280256633434b2b34 PLCSLD1EE1eeALbSide View0.1502Notes:1.This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA for additional information.2.Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3.3.D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.010 inch.4.E and eA measured with the leads constrained to be perpendicular to datum.5.Pointed or rounded lead tips are preferred to ease insertion.6.b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm).01/09/022325 Orchard ParkwaySan Jose, CA 95131TITLE8P3, 8-lead, 0.300\" Wide Body, Plastic Dual In-line Package (PDIP)DRAWING NO.8P3REV. BR14

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AT24C128/256

8S1–JEDECSOIC

321HNTop VieweBADSide ViewSYMBOLACOMMON DIMENSIONS(Unit of Measure = mm)MIN–––––NOM–––––1.27 BSC––––6.201.27MAX1.750.510.255.004.00NOTEA2CBCDELEeHLEnd ViewNote: This drawing is for general information only. Refer to JEDEC Drawing MS-012 for proper dimensions, tolerances, datums, etc.10/10/01 2325 Orchard Parkway San Jose, CA 95131TITLE8S1, 8-lead (0.150\" Wide Body), Plastic Gull Wing Small Outline (JEDEC SOIC)DRAWING NO.8S1REV. AR15

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8S2–EIAJSOIC

1HNTop ViewebA2DSide ViewSYMBOLCOMMON DIMENSIONS(Unit of Measure = mm)MINNOMMAXNOTEA1LCA2A1bC1.010.050.350.10 5.027.620.251.700.154.000.250.510.35552, 3EDEHLe5.085.228.426.056.228.890.804End View 1.27 BSCNotes:1.2.3.4.5.This drawing is for general information only; refer to EIAJ Drawing EDR-7320 for additional information.Mismatch of the upper and lower dies and resin burrs aren't included.It is recommended that upper and lower cavities be equal. If they are different, the larger dimension shall be regarded.Determines the true geometric position.Values b,C apply to pb/Sn solder plated terminal. The standard thickness of the solder layer shall be 0.010 +0.010/-0.005 mm.1/9/022325 Orchard ParkwaySan Jose, CA 95131TITLE8S2, 8-lead, 0.209\" Body, Plastic Small Outline Package (EIAJ)DRAWING NO.REV. A8S2R16

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AT24C128/256

8U1–dBGA

ED Pin 1 Markthis cornerTop View-Z-8761234Øb00..1058MMZZXYCOMMON DIMENSIONS(Unit of Measure = mm)SYMBOLMINNOMMAXNOTE##D3.730.74 TYP2.210.73 TYP0.75 TYP0.75 TYP0.90 REF0.490.350.470.520.380.500.550.410.53d5#D1EE1edAA1A2Øb#D1E1eA2AA1Bottom ViewSide ViewNotes:1.This drawing is for general information only. No JEDEC Drawing to refer to for additional information.2.Dimension is measured at the maximum solder ball diameter, parallel to primary datum Z.1/9/022325 Orchard ParkwaySan Jose, CA 95131TITLE8U1, 8-ball 0.75 pitch, Die Ball Grid ArrayPackage (dBGA) AT24C128 (AT19863)DRAWING NO.8U1REV. AR 17

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8U6–dBGAEDPin 1 Markthis cornerTop View-Z-8761234Øb00..1058MMZZXYCOMMON DIMENSIONS(Unit of Measure = mm)SYMBOLMINNOMMAXNOTE##D3.730.74 TYP2.250.75 TYP0.75 TYP0.75 TYP0.90 REF0.490.350.470.520.380.500.550.410.53d5#D1EE1ed#D1E1eA2AA1AA1A2ØbBottom ViewSide ViewNotes:1.These drawings are for general information only. No JEDEC Drawing to refer to for additional information.2.Dimension is measured at the maximum solder ball diameter, parallel to primary datum Z.02/04/02DRAWING NO.8U6REV. AR1150 E. Cheyenne Mtn. Blvd.Colorado Springs, CO 80906TITLE8U6, 8-ball 0.75 pitch, Die Ball Grid ArrayPackage (dBGA) AT24C256 (AT19884)18

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AT24C128/256

8A2–TSSOP

321E1ENTop ViewA2COMMON DIMENSIONS(Unit of Measure = mm)SYMBOLDEMIN2.90NOM3.006.40 BSC4.30–0.800.194.40–1.00–0.65 BSC0.450.601.00 REF0.754.501.201.050.3043, 5MAX3.10NOTE2, 5beDASide ViewE1AA2bLeL1LL1End ViewNotes:1.This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper dimensions, tolerances, datums, etc.2.Dimension \"D\" does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed 0.15 mm (0.006 in) per side.3.Dimension \"E1\" does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed 0.25 mm (0.010 in) per side.4.Dimension \"b\" does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of the b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between protrusion and adjacent lead is 0.07 mm. 10/26/015.Dimension \"D\" and \"E1\" to be determined at Datum Plane H.R2325 Orchard ParkwaySan Jose, CA 95131TITLE8A2, 8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)DRAWING NO.8A2REV. A19

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14A2–TSSOP

bLL1E1EEnd VieweCOMMON DIMENSIONS(Unit of Measure = mm)SYMBOLDMIN4.904.300.800.190.65 BSC0.450.601.00 REF0.75NOM5.006.40 BSC4.401.004.501.201.050.3043, 5MAX5.10NOTE2, 5Top ViewADA2EE1AA2beSide ViewLL1Notes:1.This drawing is for general information only. Please refer to JEDEC Drawing MO-153, Variation AB-1 for additional information.2.Dimension \"D\" does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed 0.15 mm (0.006 in) per side.3.Dimension \"E1\" does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed 0.25 mm (0.010 in) per side.4.Dimension \"b\" does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of the \"b\" dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between protrusion and adjacent lead is 0.07 mm.5.Dimension \"D\" and \"E1\" to be determined at Datum Plane H.12/28/01R2325 Orchard ParkwaySan Jose, CA 95131TITLE14A2,14-lead (4.4 x 5 mm Body), 0.65 Pitch, Thin Shrink Small Outline Package (TSSOP)DRAWING NO.REV. 14A2 A20

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AtmelCorporationmakesnowarrantyfortheuseofitsproducts,otherthanthoseexpresslycontainedintheCompany’sstandardwarrantywhichisdetailedinAtmel’sTermsandConditionslocatedontheCompany’swebsite.TheCompanyassumesnoresponsibilityforanyerrorswhichmayappearinthisdocument,reservestherighttochangedevicesorspecificationsdetailedhereinatanytimewithoutnotice,anddoesnotmakeanycommitmenttoupdatetheinformationcontainedherein.NolicensestopatentsorotherintellectualpropertyofAtmelaregrantedbytheCompanyinconnectionwiththesaleofAtmelproducts,expresslyorbyimplication.Atmel’sproductsarenotauthorizedforuseascriticalcomponentsinlifesupportdevicesorsystems.

ATMEL®istheregisteredtrademarkofAtmel;dBGA™isthetrademarkofAtmel.Othertermsandproductnamesmaybethetrademarksofothers.

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