DATA SHEET
DS04-29122-1Ea
Spread Spectrum Clock Generator
MB88162
■DESCRIPTION
MB88162 is a clock generator for EMI (Electro Magnetic Interference) reduction. The peak of unnecessary radiation noise (EMI) can be attenuated by making the oscillation frequency slightly modulate periodically withthe internal modulator.
■FEATURES
••••••••••••
Input frequency : 12 MHz to 28 MHz (Multiplied by 1), 20 MHz to 42 MHz (Multiplied by 4)Multiplication rate : 1, 4
Output frequency : 12 MHz to 28 MHz (Multiplied by 1), 80 MHz to 168 MHz (Multiplied by 4)
Modulation rate : no modulation, ± 0.5%, ± 1.0%, ± 2.0%, − 1.0%, − 2.0%, − 4.0% (The terminal can be selected.)Equipped with oscillation circuit : Range of oscillation 12 MHz to 42 MHzBuilt-in oscillation stabilization capacitance : 4 pF (Typ) Modulation clock output Duty : 40% to 60%
Modulation clock Cycle-Cycle Jitter : Less than 100 ps
Low power consumption by CMOS process : 7.0 mA (24 MHz : no load, Typ-sample, Typ-condition)Power supply voltage : 2.7 V to 3.6 V (Multiplied by 1), 3.0 V to 3.6 V (Multiplied by 4)Operating temperature : − 40 °C to + 85 °C Package : BCC 18-pin
■PACKAGE18-pin plastic BCC (LCC-18P-M05) Copyright©2006-2008 FUJITSU MICROELECTRONICS LIMITED All rights reserved2006.2
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MB88162
■PIN ASSIGNMENT(TOP VIEW)NCNCNCNCS0VSSSPRDOUTS115141312111016171812NC3NC4NC5NCMB881629876OEXOUTXINVDDMLTP■PIN DESCRIPTION
Pin no.123456789101112131415161718
Pin name
S1NCNCNCNCMLTPVDDXINXOUTOENCNCNCNCS0VSSSPRDOUT
I/OI⎯⎯⎯⎯I⎯IOI⎯⎯⎯⎯I⎯IO
Description
Modulation rate setting pin (with pull-up resistance)Non-connection pin (do not connect anything) Non-connection pin (do not connect anything) Non-connection pin (do not connect anything) Non-connection pin (do not connect anything)
Multiplication rate setting pin (with pull-down resistance)Power supply voltage pin
Resonator connection pin/clock input pinResonator connection pin
Clock output enable pin (with pull-up resistance)Non-connection pin (do not connect anything) Non-connection pin (do not connect anything) Non-connection pin (do not connect anything) Non-connection pin (do not connect anything) Modulation rate setting pin (with pull-up resistance)GND pin
Modulation type setting pin (with pull-up resistance)Modulation clock output pin (OE= “L” Hi-Z output)
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MB88162
■I/O CIRCUIT TYPE
PinCircuit type22 kΩOE signalRemarks•With pull-up resistor The value of pull-up resistor isswitched by the input level of OEsignal.800 kΩ at OE= “L” (Typ)22 kΩ at OE= “H” (Typ)•CMOS hysteresis inputOE800 kΩNote : At OE=“L”22kΩ Pull Up cut50 kΩOE signalS0,S1,SPRD•With pull-up resistor 50 kΩ (Typ)•CMOS hysteresis input•Pull-up resistor is disconnected atOE= “L”, and internal signal is fixedto “L”.Note : At OE=“L”Pull Up cut•With pull-down resistor 50 kΩ (Typ)•CMOS hysteresis input•Pull-down resistor is disconnectedat OE= “L”, and internal signal isfixed to “L”.MLTPOE signal50 kΩNote : At OE=“L”Pull Down cutOE signal•CMOS output•IOL = 8.0 mA•Hi-Z output at OE = “L”OUTNote : At OE=“L”Hi-Z output(Continued)
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MB88162
(Continued)PinCircuit typeRemarks•Oscillation circuit•Built-in feedback resistance : 500 kΩ (Typ) •Built-in oscillation stabilization capacitance : 4 pF (Typ) XIN4 pFXIN, XOUTXOUT500 kΩ4 pF4
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MB88162
■HANDLING DEVICES
Preventing Latch-up
A latch-up can occur if, on this device, (a) a voltage higher than power supply voltage or a voltage lower thanGND is applied to an input or output pin or (b) a voltage higher than the rating is applied between power supplyand GND. The latch-up, if it occurs, significantly increases the power supply current and may cause thermaldestruction of an element. When you use this device, be very careful not to exceed the maximum rating.Handling unused pins
Do not leave an unused input pin open, since it may cause a malfunction. Handle by, using a pull-up or pull-down resistor.Power supply pins
Please design connecting the power supply pin of this device by as low impedance as possible from the currentsupply source.
We recommend connecting electrolytic capacitor (about 10 µF) and the ceramic capacitor (about 0.01 µF) in parallel between power supply and GND near the device, as a bypass capacitor.Oscillation circuit
Noise near the XIN pin and XOUT pin may cause the device to malfunction. Design printed circuit boards sothat electric wiring of XIN pin or XOUT pin and the resonator do not intersect other wiring. Design the printed circuit board that surrounds the XIN pin and XOUT pin with ground.
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MB88162
■BLOCK DIAGRAMVDDOEOutput enablePowerDownMultiplication rate settingMLTPModulation type settingSPRDPLL blockModulation rate settingHi-ZcontrolModulation clock outputOUTS0S1XOUTModulation rate setting4 pFReferenceclockPowerDownXINRf = 500 kΩ4 pFVSS1−MPhasecompareChargepumpV/IconversionIDACICOReference clock1−NLoop filterModulation clock output1−LModulation logicModulation rate settingS0, S1MB88162 PLL blockA glitchless IDAC (current output D/A converter) provides precise modulation, thereby dramatically reducing EMI.6
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MB88162
■PIN SETTING
After the pin setting is changed, the stabilization wait time of the modulation clock is required. The stabilizationwait time of the modulation clock takes the maximum value of Lock-Up time in “• AC Characteristics” in ■ ELECTRICAL CHARACTERISTICS.
Each setting pin contains the pull-up resistor or pull-down resistor. Therefore, these pins is set to default statefor input opened.
MLTP multiplication setting
MLTP Multiplication rate
LH
Multiplied by 1Multiplied by 4
Input Frequency12 MHz to 28 MHz20 MHz to 42 MHz
Output Frequency12 MHz to 28 MHz80 MHz to 168 MHz
RemarksDefault⎯
Note : Set MLTP pin to “L” for input opened because MLTP pin has the pull-down resistor. OE clock output enableOE
LH
Status
Modulation clock output (OUT pin) Hi-Z/Power down status
Operation status
Remarks
⎯Default
Note : When OE pin is set to “L”, all oscillation circuits/PLL stop and enter power down mode, low-power consump-tion mode. Modulation clock output (OUT pin) becomes Hi-Z state during the power down. Set OE pin to “H” for input opened because OE pin has the pull-up resistor. SPRD modulation type setting
SPRD
LH
Modulation typeCenter spreadDown spread
Remarks
⎯Default
Note : Set SPRD pin to “H” for input opened because SPRD pin has the pull-up resistor. S0/S1 modulation rate setting
S1LLHH
S0LHLH
Modulation rate
At down spreadNo modulation
− 1.0% − 2.0% − 4.0%
At center spreadNo modulation
± 0.5% ± 1.0% ± 2.0%
Remarks
⎯⎯⎯Default
Note : Set S1 and S0 pins to “H” for input opened because the pins have the pull-up resistor.
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MB88162
• Center spread
Spectrum is spread (modulated) by centering on the non-spread frequency. Radiation levelModulation width 2.0%−1.0%+1.0%FrequencyNon-spread frequencyExample of center spread modulation rate ± 1.0%• Down spread
Spectrum is spread (modulated) below the non-spread frequency. Modulation width 2.0%Radiation level−2.0%FrequencyNon-spread frequencyExample of down spread modulation rate − 2.0%8
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MB88162
■ABSOLUTE MAXIMUM RATINGS
Parameter
Power supply voltage*Input voltage*Output voltage*Storage temperature
Operation junction temperatureOutput currentOvershootUndershoot
SymbolVDDVIVOTSTTJIOVIOVERVIUNDER
Rating
Min − 0.5VSS − 0.5VSS − 0.5 − 55 − 40 − 14⎯
VSS−1.0 (tUNDER ≤ 50 ns)
Max + 4.0VDD + 0.5VDD + 0.5 + 125 + 125 + 14
VDD + 1.0 (tOVER ≤ 50 ns)
⎯
UnitVVV °C °CmAVV
* : The parameter is based on VSS = 0.0 V.
WARNING:Semiconductor devices can be permanently damaged by application of stress (voltage, current,
temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings.
Overshoot/UndershoottUNDER ≤ 50 nsVIOVER ≤ VDD + 1.0 VVDDInput pintOVER ≤ 50 nsVSSVIUNDER ≤ VSS − 1.0 V9
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MB88162
■RECOMMENDED OPERATING CONDITIONS
(VSS = 0.0 V)
ParameterPower supply voltage“H” level input voltage“L” level input voltageInput clock duty cycleOperating temperature
SymbolVDDVIHVILtDCITa
PinVDD
XIN, MLTP,OE, SPRD,S1, S0
XIN⎯
ConditionsAt MLTP = “L”At MLTP = “H”
⎯⎯Input frequency12 MHz to 42 MHz
⎯
Value
Min2.73.0VDD × 0.80
VSS40 − 40
Typ3.33.3⎯⎯50⎯
Max3.63.6VDD + 0.3VDD × 0.20
60 + 85
UnitVVV% °C
WARNING:The recommended operating conditions are required in order to ensure the normal operation of the
semiconductor device. All of the device’s electrical characteristics are warranted when the device isoperated within these ranges.
Always use semiconductor devices within their recommended operating condition ranges. Operationoutside these ranges may adversely affect reliability and could result in device failure.
No warranty is made with respect to uses, operating conditions, or combinations not represented onthe data sheet. Users considering application outside the listed conditions are advised to contact theirFUJITSU representatives beforehand.
Input clock duty cycle (tDCI = tb/ta) tatbVDD × 0.8VXINVDD × 0.2VVDD × 0.5V10
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分销商库存信息:
FUJITSU
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