24C01C_07资料

2020-07-26 来源：意榕旅游网

元器件交易网www.cecb2b.com

24C01C

1K 5.0V I2C™ Serial EEPROM

Features:

•Single supply with operation from 4.5 to 5.5V•Low-power CMOS technology:-Read current 1 mA, typical-Standby current 10 μA, typical

•2-wire serial interface, I2C™ compatible•Cascadable up to eight devices

•Schmitt Trigger inputs for noise suppression•Output slope control to eliminate ground bounce•100 kHz and 400 kHz clock compatibility•Fast page and byte write time 1 ms, typical•Self-timed erase/write cycle•16-byte page write buffer•ESD protection > 4,000V

•More than 1 million erase/write cycles•Data retention > 200 years•Factory programming available

•Packages include 8-lead PDIP, SOIC, TSSOP, DFN and MSOP

•Pb-free and RoHS compliant•Temperature ranges:

-Industrial (I): -40°C to +85°C-Automotive (E): -40°C to +125°C

Package Types

PDIP, MSOP

A0A1A2VSS

1234

8765

VCCTestSCL

A0A1A2

SOIC, TSSOP

1234

8765

VCCTestSCLSDA

SDAVSS

DFN

A01A12A23VSS4

8VCC7Test6SCL5SDA

Block Diagram

A0 A1 A2

HV Generator

MemoryControl Logic

I/OControl Logic

XDEC

EEPROM

Array

SDASCLVCCVSS

Sense Amp.R/W ControlYDEC

Description:

The Microchip Technology Inc. 24C01C is a 1K bitSerial Electrically Erasable PROM with a voltage rangeof 4.5V to 5.5V. The device is organized as a singleblock of 128x8-bit memory with a 2-wire serialinterface. Low-current design permits operation withtypical standby and active currents of only 10 μA and 1mA, respectively. The device has a page write capabil-ity for up to 16 bytes of data and has fast write cycletimes of only 1ms for both byte and page writes. Func-tional address lines allow the connection of up to eight24C01C devices on the same bus for up to 8K bits ofcontiguous EEPROM memory. The device is availablein the standard 8-pin PDIP, 8-pin SOIC (3.90 mm), 8-pin 2x3 DFN, 8-pin MSOP and TSSOP packages.

Pin Function Table

NameVSSSDASCLVCCA0, A1, A2Test

GroundSerial DataSerial Clock

+4.5V to 5.5V Power SupplyChip Selects

Test Pin: may be tied high, low or left floating

Function

I2C is a trademark of Philips Corporation.

元器件交易网www.cecb2b.com

24C01C

1.0

ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings(†)

VCC.............................................................................................................................................................................7.0VAll inputs and outputs w.r.t. VSS.........................................................................................................-0.6V to VCC +1.0VStorage temperature...............................................................................................................................-65°C to +150°CAmbient temperature with power applied................................................................................................-40°C to +125°CESD protection on all pins......................................................................................................................................................≥ 4 kV

† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage tothe device. This is a stress rating only and functional operation of the device at those or any other conditionsabove those indicated in the operational listings of this specification is not implied. Exposure to maximum ratingconditions for extended periods may affect device reliability.

TABLE 1-1:DC CHARACTERISTICS

VCC = +4.5V to +5.5VIndustrial (I):Automotive (E):SymbolVIHVILVHYSVOLILIILOCIN, COUTICC ReadICC WriteICCS

——————0.05 VCCMin.0.7 VCC

TA = -40°C to +85°CTA = -40°C to +125°CMax.—.3 VCC—.40±1±1101350

UnitsVVVVμAμApFmAmAμA

(Note)

IOL = 3.0 mA, VCC = 4.5VVIN = VSS or VCC, WP = VssVOUT = VSS or VCCVCC = 5.0V (Note)TA = 25°C, f = 1 MHzVCC = 5.5V, SCL = 400 kHzVCC = 5.5V

VCC = 5.5V, SDA = SCL = VCCWP = VSS

Conditions

All parameters apply across the specified operating ranges unless otherwise noted.

Parameter

SCL and SDA pins:

High-level input voltageLow-level input voltage

Hysteresis of Schmitt Triggerinputs

Low-level output voltageInput leakage currentOutput leakage current

Pin capacitance (all inputs/outputs)Operating currentStandby currentNote:

This parameter is periodically sampled and not 100% tested.

元器件交易网www.cecb2b.com

24C01C

TABLE 1-2:

AC CHARACTERISTICS

Vcc = 4.5V to 5.5VIndustrial (I):Automotive (E):Max.100——1000300—————3500—

Min.—6001300——6006000100600—1300

TA- = -40°C to +85°CTA- = -40°C to +125°CMax.400——300300—————900—

UnitskHznsnsnsnsnsnsnsnsnsnsns

Remarks

All parameters apply across the specified operating ranges unless otherwise noted.

Parameter

Clock frequencyClock high timeClock low time

SDA and SCL rise timeSDA and SCL fall timeStart condition hold timeStart condition setup timeData input hold timeData input setup timeStop condition setup timeOutput valid from clockBus free time

SymbolFCLKTHIGHTLOWTRTF

THD:STATSU:STATHD:DATTSU:DATTSU:STOTAATBUF

Tamb > +85°C-40°C ≤ Tamb ≤ +85°CMin.—40004700——4000470002504000—4700

(Note1)(Note1)

After this period the first clock pulse is generatedOnly relevant for repeated Start condition(Note2)

TOFOutput fall time from VIH

minimum to VIL maximum

Input filter spike suppressionTSP(SDA and SCL pins)Write cycle timeTWREnduranceNote1:

3:4:

———1M

250501.5—

20 +0.1 CB

——1M

250501—

nsns

(Note2)

Time the bus must be free before a new transmission can start

(Note 1), CB ≤ 100 pF(Note3)

msByte or Page mode

cycles25°C, VCC = 5.0V, Block

mode (Note4)

Not 100% tested. CB = total capacitance of one bus line in pF.

As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region (minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.The combined TSP and VHYS specifications are due to Schmitt Trigger inputs which provide improved noise spike suppression. This eliminates the need for a TI specification for standard operation.

This parameter is not tested but ensured by characterization. For endurance estimates in a specific

application, please consult the Total Endurance™ Model which can be obtained from Microchip’s web site at www.microchip.com.

元器件交易网www.cecb2b.com

24C01C

2.0

2.1

PIN DESCRIPTIONS

SDA Serial Data

3.0FUNCTIONAL DESCRIPTION

This is a bidirectional pin used to transfer addressesand data into and data out of the device. It is an opendrain terminal, therefore the SDA bus requires a pull-upresistor to VCC (typical 10 kΩ for 100 kHz, 2 kΩ for400kHz).

For normal data transfer SDA is allowed to change onlyduring SCL low. Changes during SCL high arereserved for indicating the Start and Stop conditions.

The 24C01C supports a bidirectional 2-wire bus anddata transmission protocol. A device that sends dataonto the bus is defined as transmitter, and a devicereceiving data as receiver. The bus has to be controlledby a master device which generates the Serial Clock(SCL), controls the bus access, and generates the Startand Stop conditions, while the 24C01C works as slave.Both master and slave can operate as transmitter orreceiver, but the master device determines which modeis activated.

2.2SCL Serial Clock

This input is used to synchronize the data transfer fromand to the device.

2.3A0, A1, A2

The levels on these inputs are compared with thecorresponding bits in the slave address. The chip isselected if the compare is true.

Up to eight 24C01C devices may be connected to thesame bus by using different Chip Select bit combina-tions. These inputs must be connected to either VCC orVSS.

2.4Test

This pin is utilized for testing purposes only. It may betied high, tied low or left floating.

2.5Noise Protection

The 24C01C employs a VCC threshold detector circuitwhich disables the internal erase/write logic if the VCCis below 3.8 volts at nominal conditions.

The SCL and SDA inputs have Schmitt Trigger andfilter circuits which suppress noise spikes to assureproper device operation even on a noisy bus.

元器件交易网www.cecb2b.com

24C01C

4.0

BUS CHARACTERISTICS

The following bus protocol has been defined:•Data transfer may be initiated only when the bus is not busy.

•During data transfer, the data line must remain stable whenever the clock line is high. Changes in the data line while the clock line is high will be interpreted as a Start or Stop condition.

Accordingly, the following bus conditions have beendefined (Figure4-1).

The data on the line must be changed during the lowperiod of the clock signal. There is one bit of data perclock pulse.

Each data transfer is initiated with a Start condition andterminated with a Stop condition. The number of thedata bytes transferred between the Start and Stopconditions is determined by the master device and istheoretically unlimited, although only the last sixteenwill be stored when doing a write operation. When anoverwrite does occur it will replace data in a first-in first-out fashion.

4.1Bus Not Busy (A)

4.5Acknowledge

Both data and clock lines remain high.

4.2Start Data Transfer (B)

Each receiving device, when addressed, is required togenerate an acknowledge after the reception of eachbyte. The master device must generate an extra clockpulse which is associated with this Acknowledge bit.Note:

The 24C01C does not generate anyAcknowledge bits if an internal program-ming cycle is in progress.

A high-to-low transition of the SDA line while the clock(SCL) is high determines a Start condition. Allcommands must be preceded by a Start condition.

4.3Stop Data Transfer (C)

A low-to-high transition of the SDA line while the clock(SCL) is high determines a Stop condition. Alloperations must be ended with a Stop condition.

4.4Data Valid (D)

The state of the data line represents valid data when,after a Start condition, the data line is stable for theduration of the high period of the clock signal.

The device that acknowledges has to pull down theSDA line during the Acknowledge clock pulse in such away that the SDA line is stable low during the highperiod of the acknowledge related clock pulse. Ofcourse, setup and hold times must be taken intoaccount. A master must signal an end of data to theslave by not generating an Acknowledge bit on the lastbyte that has been clocked out of the slave. In this case,the slave must leave the data line high to enable themaster to generate the Stop condition (Figure4-2).

FIGURE 4-1:SCL(A)(B)DATA TRANSFER SEQUENCE ON THE SERIAL BUS CHARACTERISTICS(C)(D)(C)(A)SDAStartConditionAddress orAcknowledgeValidDataAllowedto ChangeStopConditionFIGURE 4-2:ACKNOWLEDGE TIMINGAcknowledgeBitSCL123456789123SDAData from transmitterTransmitter must release the SDA line at this pointallowing the Receiver to pull the SDA line low toacknowledge the previous eight bits of data.Data from transmitterReceiver must release the SDA line at thispoint so the Transmitter can continue send-ing data.© 2007 Microchip Technology Inc.DS21201G-page 5

元器件交易网www.cecb2b.com

24C01C

5.0

DEVICE ADDRESSING

FIGURE 5-1:

CONTROL BYTE FORMAT

Read/Write Bit

Control CodeS

Chip Select

BitsA2

A1A0R/WACK

A control byte is the first byte received following theStart condition from the master device (Figure5-1).The control byte consists of a four-bit control code; forthe 24C01C this is set as ‘1010’ binary for read andwrite operations. The next three bits of the control byteare the Chip Select bits (A2, A1, A0). The Chip Selectbits allow the use of up to eight 24C01C devices on thesame bus and are used to select which device isaccessed. The Chip Select bits in the control byte mustcorrespond to the logic levels on the corresponding A2,A1 and A0 pins for the device to respond. These bitsare in effect the three Most Significant bits of the wordaddress.

The last bit of the control byte defines the operation tobe performed. When set to a ‘1’ a read operation isselected, and when set to a ‘0’ a write operation isselected. Following the Start condition, the 24C01Cmonitors the SDA bus checking the control byte beingtransmitted. Upon receiving a ‘1010’ code and appro-priate Chip Select bits, the slave device outputs anAcknowledge signal on the SDA line. Depending on thestate of the R/W bit, the 24C01C will select a read orwrite operation.

Slave Address

Start Bit

Acknowledge Bit

5.1

Contiguous Addressing Across Multiple Devices

The Chip Select bits A2, A1, A0 can be used to expandthe contiguous address space for up to 8K bits byadding up to eight 24C01C devices on the same bus.In this case, software can use A0 of the control byte asaddress bit A8, A1 as address bit A9, and A2 asaddress bit A10. It is not possible to write or readacross device boundaries.

元器件交易网www.cecb2b.com

24C01C

6.0

6.1

WRITE OPERATIONS

Byte Write

Following the Start signal from the master, the devicecode(4 bits), the Chip Select bits (3 bits), and theR/Wbit, which is a logic low, is placed onto the bus by themaster transmitter. The device will acknowledge thiscontrol byte during the ninth clock pulse. The next bytetransmitted by the master is the word address and willbe written into the Address Pointer of the 24C01C.After receiving another Acknowledge signal from the24C01C the master device will transmit the data wordto be written into the addressed memory location. The24C01C acknowledges again and the master gener-ates a Stop condition. This initiates the internal writecycle, and during this time the 24C01C will notgenerate Acknowledge signals (Figure6-1).

After the receipt of each word, the four lower orderAddress Pointer bits are internally incremented by one.The higher order four bits of the word address remainsconstant. If the master should transmit more than 16bytes prior to generating the Stop condition, theaddress counter will roll over and the previouslyreceived data will be overwritten. As with the byte writeoperation, once the Stop condition is received aninternal write cycle will begin (Figure6-2).Note:

Page write operations are limited to writingbytes within a single physical page,regardless of the number of bytes actuallybeing written. Physical page boundariesstart at addresses that are integermultiples of the page buffer size (or ‘pagesize’) and end at addresses that areinteger multiples of [page size – 1]. If aPage Write command attempts to writeacross a physical page boundary, theresult is that the data wraps around to thebeginning of the current page (overwritingdata previously stored there), instead ofbeing written to the next page as might beexpected. It is therefore necessary for theapplication software to prevent page writeoperations that would attempt to cross apage boundary.

6.2Page Write

The write control byte, word address and the first databyte are transmitted to the 24C01C in the same way asin a byte write. But instead of generating a Stopcondition, the master transmits up to 15 additional databytes to the 24C01C which are temporarily stored inthe on-chip page buffer and will be written into thememory after the master has transmitted a Stopcondition.

FIGURE 6-1:

Bus ActivityMasterSDA LineBus Activity

STARTS

BYTE WRITE

ControlByte

WordAddress

Data

STOPP

ACK

FIGURE 6-2:

Bus ActivityMasterSDA LineBus Activity

STARTS

PAGE WRITE

ControlByte

WordAddress (n)

STOPP

ACK

Data nData n +1Data n + 15

元器件交易网www.cecb2b.com

24C01C

7.0

ACKNOWLEDGE POLLING

FIGURE 7-1:

Since the device will not acknowledge during a writecycle, this can be used to determine when the cycle iscomplete (this feature can be used to maximize busthroughput). Once the Stop condition for a Writecommand has been issued from the master, the deviceinitiates the internally timed write cycle. ACK pollingcan be initiated immediately. This involves the mastersending a Start condition followed by the control bytefor a Write command (R/W = 0). If the device is stillbusy with the write cycle, then no ACK will be returned.If no ACK is returned, then the Start bit and control bytemust be re-sent. If the cycle is complete, then thedevice will return the ACK and the master can thenproceed with the next Read or Write command. SeeFigure7-1 for flow diagram.

ACKNOWLEDGE POLLING FLOW

Send

Write Command

Send StopCondition toInitiate Write Cycle

Send Start

Send Control Bytewith R/W = 0

Did DeviceAcknowledge(ACK = 0)?Yes

NextOperation

元器件交易网www.cecb2b.com

24C01C

8.0

READ OPERATIONS

Read operations are initiated in the same way as writeoperations with the exception that the R/W bit of theslave address is set to one. There are three basic typesof read operations: current address read, random readand sequential read.

After the word address is sent, the master generates aStart condition following the acknowledge. Thisterminates the write operation, but not before theinternal Address Pointer is set. Then the master issuesthe control byte again but with the R/W bit set to a one.The 24C01C will then issue an acknowledge and trans-mits the eight bit data word. The master will notacknowledge the transfer, but does generate a Stopcondition and the 24C01C discontinues transmission(Figure8-2). After this command, the internal addresscounter will point to the address location following theone that was just read.

8.1Current Address Read

The 24C01C contains an address counter that main-tains the address of the last word accessed, internallyincremented by one. Therefore, if the previous readaccess was to address n, the next current address readoperation would access data from address n + 1. Uponreceipt of the slave address with the R/W bit set to one,the 24C01C issues an acknowledge and transmits theeight-bit data word. The master will not acknowledgethe transfer, but does generate a Stop condition and the24C01C discontinues transmission (Figure8-1).

8.3Sequential Read

Sequential reads are initiated in the same way as arandom read except that after the 24C01C transmitsthe first data byte, the master issues an acknowledgeas opposed to a Stop condition in a random read. Thisdirects the 24C01C to transmit the next sequentiallyaddressed 8-bit word (Figure8-3).

To provide sequential reads the 24C01C contains aninternal Address Pointer which is incremented by oneat the completion of each operation. This AddressPointer allows the entire memory contents to be seriallyread during one operation. The internal AddressPointer will automatically roll over from address 7F toaddress 00.

8.2Random Read

Random read operations allow the master to accessany memory location in a random manner. To performthis type of read operation, first the word address mustbe set. This is done by sending the word address to the24C01C as part of a write operation.

FIGURE 8-1:CURRENT ADDRESS READ

Bus ActivityMasterSDA LineBus Activity

STARTS

ACK

NOACK

ControlByte

Data

STOPP

FIGURE 8-2:RANDOM READ

STARTS

ACK

ControlByte

WordAddress (n)

STARTS

ACK

NOACK

Bus ActivityMaster

ControlByte

Data (n)

STOPP

SDA LineBus Activity

元器件交易网www.cecb2b.com

24C01C

FIGURE 8-3:

Bus ActivityMasterSDA LineBus Activity

ACK

NOACK

SEQUENTIAL READ

ControlByte

Data n

Data n + 1

Data n + 2

Data n + X

STOPP

元器件交易网www.cecb2b.com

24C01C

9.0

9.1

PACKAGING INFORMATION

Package Marking Information

8-Lead PDIP (300 mil)

XXXXXXXXT/XXXNNNYYWWExample:

24C01CI/P 13Fe305278-Lead SOIC (3.90 mm)

XXXXXXXTXXXXYYWWNNNExample:24C01CIe3SN 052713F8-Lead TSSOP

XXXXTYWWNNNExample:

4C1CI52713F8-Lead MSOP

Example:

XXXXTYWWNNN4C1CI52713F

8-Lead 2x3 DFN

XXXYWWNNExample:

元器件交易网www.cecb2b.com

24C01C

1st Line Marking Codes

Part Number

TSSOP4C1C

T = Temperature grade (I, E)

Legend:XX...XTYYYWWNNN e3Note:Part number or part number codeTemperature (I, E)Year code (last digit of calendar year)Year code (last 2 digits of calendar year)Week code (week of January 1 is week ‘01’)Alphanumeric traceability code (2 characters for small packages)Pb-free JEDEC designator for Matte Tin (Sn)MSOP4C1CT

DFN

I Temp.2N7

E Temp.2N8

24C01CNote:

For very small packages with no room for the Pb-free JEDEC designatore3 , the marking will only appear on the outer carton or reel label.In the event the full Microchip part number cannot be marked on one line, it willbe carried over to the next line, thus limiting the number of availablecharacters for customer-specific information.Note:Note:Please visit www.microchip.com/Pbfree for the latest information on Pb-free conversion.

*Standard OTP marking consists of Microchip part number, year code, week code, and traceability code.

元器件交易网www.cecb2b.com

24C01C

8-Lead Plastic Dual In-Line (P or PA) – 300 mil Body [PDIP]Note:For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packagingNNOTE 1E112D3EA2AA1eb1bLceBUnitsDimension LimitsNumber of PinsPitchTop to Seating PlaneMolded Package ThicknessBase to Seating PlaneShoulder to Shoulder WidthMolded Package WidthOverall LengthTip to Seating PlaneLead ThicknessUpper Lead WidthLower Lead WidthOverall Row Spacing §NeAA2A1EE1DLcb1beB–.115.015.290.240.348.115.008.040.014–MININCHESNOM8.100 BSC–.130–.310.250.365.130.010.060.018–.210.195–.325.280.400.150.015.070.022.430MAXNotes:1.Pin 1 visual index feature may vary, but must be located with the hatched area.2.§ Significant Characteristic.3.Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010\" per side.4.Dimensioning and tolerancing per ASME Y14.5M.BSC: Basic Dimension. Theoretically exact value shown without tolerances.MicrochipTechnologyDrawingC04-018B© 2007 Microchip Technology Inc.DS21201G-page 13

元器件交易网www.cecb2b.com

24C01C

8-Lead Plastic Small Outline (SN or OA) – Narrow, 3.90 mm Body [SOIC]Note:For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packagingDeNEE1NOTE 1123bhφchαAA2A1LL1βUnitsDimension LimitsNumber of PinsPitchOverall HeightMolded Package ThicknessStandoff §Overall WidthMolded Package WidthOverall LengthChamfer (optional)Foot LengthFootprintFoot AngleLead ThicknessLead WidthMold Draft Angle TopMold Draft Angle BottomNeAA2A1EE1DhLL1φcbαβ0°0.170.315°5°0.250.40–1.250.10MINMILLIMETERSNOM81.27 BSC–––6.00 BSC3.90 BSC4.90 BSC––1.04 REF–––––8°0.250.5115°15°0.501.271.75–0.25MAXNotes:1.Pin 1 visual index feature may vary, but must be located within the hatched area.2.§ Significant Characteristic.3.Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.4.Dimensioning and tolerancing per ASME Y14.5M.BSC:Basic Dimension. Theoretically exact value shown without tolerances.REF:Reference Dimension, usually without tolerance, for information purposes only.MicrochipTechnologyDrawingC04-057BDS21201G-page 14© 2007 Microchip Technology Inc.

元器件交易网www.cecb2b.com

24C01C

8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body [TSSOP]Note:For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packagingDNEE1NOTE 11b2ecAA2φA1L1LUnitsDimension LimitsNumber of PinsPitchOverall HeightMolded Package ThicknessOverall WidthMolded Package WidthMolded Package LengthFoot LengthFootprintFoot AngleLead ThicknessLead WidthNeAA2EE1DLL1φcb0°0.090.194.302.900.45–0.800.05MINMILLIMETERSNOM80.65 BSC–1.00–6.40 BSC4.403.000.601.00 REF–––8°0.200.304.503.100.751.201.050.15MAXStandoff A1Notes:1.Pin 1 visual index feature may vary, but must be located within the hatched area.2.Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.3.Dimensioning and tolerancing per ASME Y14.5M.BSC:Basic Dimension. Theoretically exact value shown without tolerances.REF:Reference Dimension, usually without tolerance, for information purposes only.MicrochipTechnologyDrawingC04-086B© 2007 Microchip Technology Inc.DS21201G-page 15

元器件交易网www.cecb2b.com

24C01C

8-Lead Plastic Micro Small Outline Package (MS or UA) [MSOP]Note:For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packagingDNEE1NOTE 112ebAA2cφA1UnitsDimension LimitsNumber of PinsPitchOverall HeightMolded Package ThicknessOverall WidthMolded Package WidthOverall LengthFoot LengthFootprintFoot AngleLead ThicknessLead WidthNeAA2EE1DLL1φcbL1MILLIMETERSMINNOM80.65 BSC–0.750.00–0.85–4.90 BSC3.00 BSC3.00 BSC0.400°0.080.220.600.95 REF–––8°0.230.400.801.100.950.15MAXLStandoff A1Notes:1.Pin 1 visual index feature may vary, but must be located within the hatched area.2.Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.3.Dimensioning and tolerancing per ASME Y14.5M.BSC:Basic Dimension. Theoretically exact value shown without tolerances.REF:Reference Dimension, usually without tolerance, for information purposes only.MicrochipTechnologyDrawingC04-111BDS21201G-page 16© 2007 Microchip Technology Inc.

元器件交易网www.cecb2b.com

24C01C

8-Lead Plastic Dual Flat, No Lead Package (MC) – 2x3x0.9 mm Body [DFN]Note:For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packagingeNLDNbKEE2EXPOSED PADNOTE 112D2TOP VIEWBOTTOM VIEW21NOTE 1AA3A1NOTE 2UnitsDimension LimitsMINMILLIMETERSNOM80.50 BSC0.800.000.900.020.20 REF2.00 BSC3.00 BSC1.301.500.180.300.20––0.250.40–1.751.900.300.50–1.000.05MAXNumber of PinsPitchOverall HeightContact ThicknessOverall LengthOverall WidthExposed Pad LengthExposed Pad WidthContact WidthContact LengthContact-to-Exposed PadNeAA3DED2E2bLKStandoff A1Notes:1.Pin 1 visual index feature may vary, but must be located within the hatched area.2.Package may have one or more exposed tie bars at ends.3.Package is saw singulated.4.Dimensioning and tolerancing per ASME Y14.5M.BSC:Basic Dimension. Theoretically exact value shown without tolerances.REF:Reference Dimension, usually without tolerance, for information purposes only.MicrochipTechnologyDrawingC04-123B© 2007 Microchip Technology Inc.DS21201G-page 17

元器件交易网www.cecb2b.com

24C01C

APPENDIX A:

Revision D

Corrections to Section 1.0, Electrical Characteristics.

REVISION HISTORY

Revision E

Added DFN package.

Revision F (01/2007)

Revised Features Section; Deleted Commercial Temp;Replaced Package Drawings; Replaced On-LineSupport page; Revised Product ID System.

Revision G (03/2007)

Replaced Package Drawings (Rev. AM).

元器件交易网www.cecb2b.com

24C01C

THE MICROCHIP WEB SITE

Microchip provides online support via our WWW site atwww.microchip.com. This web site is used as a meansto make files and information easily available tocustomers. Accessible by using your favorite Internetbrowser, the web site contains the followinginformation:

•Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software

•General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing

•Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of

Microchip sales offices, distributors and factory representatives

CUSTOMER SUPPORT

Users of Microchip products can receive assistancethrough several channels:•••••

Distributor or RepresentativeLocal Sales Office

Field Application Engineer (FAE)Technical Support

Development Systems Information Line

Customers should contact their distributor,representative or field application engineer (FAE) forsupport. Local sales offices are also available to helpcustomers. A listing of sales offices and locations isincluded in the back of this document.

Technical support is available through the web siteat: http://support.microchip.com

CUSTOMER CHANGE NOTIFICATION SERVICE

Microchip’s customer notification service helps keepcustomers current on Microchip products. Subscriberswill receive e-mail notification whenever there arechanges, updates, revisions or errata related to aspecified product family or development tool of interest.To register, access the Microchip web site atwww.microchip.com, click on Customer ChangeNotification and follow the registration instructions.

元器件交易网www.cecb2b.com

24C01C

READER RESPONSE

It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod-uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentationcan better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.Please list the following information, and use this outline to provide us with your comments about this document.

To:RE:

Technical Publications ManagerReader Response

Total Pages Sent ________

From:Name

CompanyAddress

City / State / ZIP / Country

Telephone: (_______) _________ - _________

Application (optional):

Would you like a reply? Y N

24C01CDS21201GDevice: Literature Number: Questions:

1.What are the best features of this document?

FAX: (______) _________ - _________

2.How does this document meet your hardware and software development needs?

3.Do you find the organization of this document easy to follow? If not, why?

4.What additions to the document do you think would enhance the structure and subject?

5.What deletions from the document could be made without affecting the overall usefulness?

6.Is there any incorrect or misleading information (what and where)?

7.How would you improve this document?

元器件交易网www.cecb2b.com

24C01C

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

PART NO.Device

XTemperatureRange

/XXPackage

Device:

24C01C 1K I2C Serial EEPROM

24C01CT 1K I2C Serial EEPROM (Tape and Reel)IEPSNSTMSMC

=-40°C to+85°C=-40°C to+125°C=====

Plastic DIP (300 mil Body), 8-leadPlastic SOIC, (3.90 mm Body), 8-leadTSSOP (4.4 mm Body), 8-lead

Plastic Micro Small Outline (MSOP), 8-lead2x3 DFN, 8-lead

Temperature Range:Package:

元器件交易网www.cecb2b.com

24C01C

NOTES:

元器件交易网www.cecb2b.com

Note the following details of the code protection feature on Microchip devices:•••

Microchip products meet the specification contained in their particular Microchip Data Sheet.

Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions.

There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

Microchip is willing to work with the customer who is concerned about the integrity of their code.

Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.”

••

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of ourproducts. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such actsallow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding deviceapplications and the like is provided only for your convenienceand may be superseded by updates. It is your responsibility toensure that your application meets with your specifications.MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS ORIMPLIED, WRITTEN OR ORAL, STATUTORY OROTHERWISE, RELATED TO THE INFORMATION,INCLUDING BUT NOT LIMITED TO ITS CONDITION,QUALITY, PERFORMANCE, MERCHANTABILITY ORFITNESS FOR PURPOSE. Microchip disclaims all liabilityarising from this information and its use. Use of Microchipdevices in life support and/or safety applications is entirely atthe buyer’s risk, and the buyer agrees to defend, indemnify andhold harmless Microchip from any and all damages, claims,suits, or expenses resulting from such use. No licenses areconveyed, implicitly or otherwise, under any Microchipintellectual property rights.

Trademarks

The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, KEELOQ logo, microID, MPLAB, PIC,

PICmicro, PICSTART, PROMATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip

Technology Incorporated in the U.S.A. and other countries.AmpLab, FilterLab, Linear Active Thermistor, Migratable Memory, MXDEV, MXLAB, PS logo, SEEVAL, SmartSensor and The Embedded Control Solutions Company are

registered trademarks of Microchip Technology Incorporated in the U.S.A.

Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,

In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total

Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.

All other trademarks mentioned herein are property of their respective companies.

Printed on recycled paper.

Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona, Gresham, Oregon and Mountain View, California. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog

products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.

元器件交易网www.cecb2b.com

WORLDWIDE SALES AND SERVICE

AMERICAS

Corporate Office

2355 West Chandler Blvd.Chandler, AZ 85224-6199Tel: 480-792-7200 Fax: 480-792-7277Technical Support:

http://support.microchip.comWeb Address:

www.microchip.comAtlantaDuluth, GA

Tel: 678-957-9614 Fax: 678-957-1455Boston

Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088ChicagoItasca, IL

Tel: 630-285-0071 Fax: 630-285-0075Dallas

Addison, TX

Tel: 972-818-7423 Fax: 972-818-2924Detroit

Farmington Hills, MI Tel: 248-538-2250Fax: 248-538-2260KokomoKokomo, IN

Tel: 765-864-8360Fax: 765-864-8387Los Angeles

Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608Santa Clara

Santa Clara, CA Tel: 408-961-6444Fax: 408-961-6445Toronto

Mississauga, Ontario, Canada

Tel: 905-673-0699 Fax: 905-673-6509

ASIA/PACIFIC

Asia Pacific Office

Suites 3707-14, 37th FloorTower 6, The GatewayHabour City, KowloonHong Kong

Tel: 852-2401-1200Fax: 852-2401-3431Australia - SydneyTel: 61-2-9868-6733Fax: 61-2-9868-6755China - Beijing

Tel: 86-10-8528-2100 Fax: 86-10-8528-2104China - ChengduTel: 86-28-8665-5511Fax: 86-28-8665-7889China - Fuzhou

Tel: 86-591-8750-3506 Fax: 86-591-8750-3521China - Hong Kong SARTel: 852-2401-1200 Fax: 852-2401-3431China - Qingdao

Tel: 86-532-8502-7355Fax: 86-532-8502-7205China - ShanghaiTel: 86-21-5407-5533 Fax: 86-21-5407-5066China - ShenyangTel: 86-24-2334-2829Fax: 86-24-2334-2393China - ShenzhenTel: 86-755-8203-2660 Fax: 86-755-8203-1760China - Shunde

Tel: 86-757-2839-5507 Fax: 86-757-2839-5571China - Wuhan

Tel: 86-27-5980-5300Fax: 86-27-5980-5118China - Xian

Tel: 86-29-8833-7250Fax: 86-29-8833-7256

ASIA/PACIFIC

India - BangaloreTel: 91-80-4182-8400 Fax: 91-80-4182-8422India - New DelhiTel: 91-11-4160-8631Fax: 91-11-4160-8632India - Pune

Tel: 91-20-2566-1512Fax: 91-20-2566-1513Japan - YokohamaTel: 81-45-471- 6166 Fax: 81-45-471-6122Korea - Gumi

Tel: 82-54-473-4301Fax: 82-54-473-4302Korea - SeoulTel: 82-2-554-7200Fax: 82-2-558-5932 or 82-2-558-5934Malaysia - PenangTel: 60-4-646-8870Fax: 60-4-646-5086Philippines - ManilaTel: 63-2-634-9065Fax: 63-2-634-9069Singapore

Tel: 65-6334-8870Fax: 65-6334-8850Taiwan - Hsin ChuTel: 886-3-572-9526Fax: 886-3-572-6459Taiwan - KaohsiungTel: 886-7-536-4818Fax: 886-7-536-4803Taiwan - Taipei

Tel: 886-2-2500-6610 Fax: 886-2-2508-0102Thailand - BangkokTel: 66-2-694-1351Fax: 66-2-694-1350

EUROPE

Austria - Wels

Tel: 43-7242-2244-39Fax: 43-7242-2244-393Denmark - CopenhagenTel: 45-4450-2828 Fax: 45-4485-2829France - Paris

Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79Germany - MunichTel: 49-89-627-144-0 Fax: 49-89-627-144-44Italy - Milan

Tel: 39-0331-742611 Fax: 39-0331-466781Netherlands - DrunenTel: 31-416-690399 Fax: 31-416-690340Spain - Madrid

Tel: 34-91-708-08-90Fax: 34-91-708-08-91UK - WokinghamTel: 44-118-921-5869Fax: 44-118-921-5820

12/08/06

因篇幅问题不能全部显示，请点此查看更多更全内容

查看全文

全部栏目

24C01C_07资料